Technical Parameters
| MTJ 1050 Automatic deep embossing and hot stamping machine | |
| Model | MTJ-1050 Automatic Deep Embossing And Hot Stamping Machine |
| Max.paper size | 1060×800mm |
| Min.paper size | 400×360mm |
| Max.die-cutting size | 1050×750mm |
| Die-cutting precision | ±0.075mm |
| Max.working pressure | 750T |
| Max.working Speed | 7600P/H |
| Air requirements | 0.7~1.0Mp 0.6m³ |
| Paper thickness | White card/plastic sheet:0.1~1.8mm Grey board:<4mm Corrugated paper:<5mm |
| Gripper range | 3~8mm |
| First die line distance from template | 15mm |
| Motor power | 18.5Kw |
| Total Power | 67Kw |
| Total heating power | 27.8Kw |
| Servo total power | 16Kw |
| Working power | 35Kw |
| Weight | 23T |
| Dimensions | 6502×2808×2510mm pedal width1750mm |
Sketch


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